| Backing Material: | |
|---|---|
| Adhesive Type: | |
| Color: | |
Features
High temperature resistance (up to 280°C) short time.
Excellent reuse time.
Application
FPC carrier bonding SMT reflow soldering process
Technical data
Backing Material | Fiberglass | |
Adhesive Type | Silicone | |
Color | Yellow | |
Total Thickness | 205µm | |
Peel Adhesion | A side <7 | N/inch |
Elongation at break | 5 | % |
Temperature resistance (30 min) remove without residue | 280 °C |
Storage | Store under normal conditions of 60° to 80°F (16° to 27°C) and 40 to 60% relative humidity in the original packaging material. |
Shelf life | To obtain best performance, use this product within 12 months from date of manufacture. |
Sizes | In 1000mm width log roll. All rolls can be slit from 2 mm to log roll width |