Features
High temperature resistance (up to 268°C)
Residue-free removability for masking applications
Application
KPT201-2535 is used for various applications, especially for PCB solder masking, thermal insulation and cable wrapping etc.
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Technical data
Backing Material | Polyimide | |
Adhesive Type | Silicone | |
Color | Amber | |
Total Thickness | 60µm | |
Peel Adhesion | >6 | N/inch |
Elongation at break | 35 | % |
Tensile strength | >30 | N/10mm |
Dielectric breakdown | >4 | KV |
Temperature resistance (30 min) remove without residue | 268 °C |
Storage | Store under normal conditions of 60° to 80°F (16° to 27°C) and 40 to 60% relative humidity in the original packaging material. |
Shelf life | To obtain best performance, use this product within 12 months from date of manufacture. |
Sizes | In 500mm width log roll. All rolls can be slit from 2 mm to log roll width |
